H05K 2203/11
Treatments characterised by their effect
Official title: Treatments characterised by their effect, e.g. heating, cooling, roughening
H05K2203/11 (Treatments characterised by their effect) appears on 2,989 US grants and 3,207 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,989
- Published applications
- 3,207
- Assignees
- 1,270
- Inventors
- 7,365
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 9 | 0 |
| 1978 | 14 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 11 | 0 |
| 1982 | 12 | 0 |
| 1983 | 16 | 0 |
| 1984 | 17 | 0 |
| 1985 | 27 | 0 |
| 1986 | 19 | 0 |
| 1987 | 39 | 0 |
| 1988 | 34 | 0 |
| 1989 | 39 | 0 |
| 1990 | 35 | 0 |
| 1991 | 41 | 0 |
| 1992 | 54 | 0 |
| 1993 | 45 | 0 |
| 1994 | 50 | 0 |
| 1995 | 42 | 0 |
| 1996 | 41 | 0 |
| 1997 | 43 | 0 |
| 1998 | 63 | 0 |
| 1999 | 68 | 0 |
| 2000 | 60 | 0 |
| 2001 | 68 | 37 |
| 2002 | 81 | 87 |
| 2003 | 90 | 101 |
| 2004 | 79 | 140 |
| 2005 | 74 | 170 |
| 2006 | 64 | 140 |
| 2007 | 91 | 194 |
| 2008 | 61 | 215 |
| 2009 | 79 | 231 |
| 2010 | 114 | 184 |
| 2011 | 111 | 121 |
| 2012 | 123 | 90 |
| 2013 | 88 | 78 |
| 2014 | 74 | 107 |
| 2015 | 74 | 156 |
| 2016 | 91 | 112 |
| 2017 | 103 | 116 |
| 2018 | 105 | 106 |
| 2019 | 98 | 128 |
| 2020 | 113 | 124 |
| 2021 | 97 | 119 |
| 2022 | 93 | 79 |
| 2023 | 49 | 73 |
| 2024 | 78 | 76 |
| 2025 | 57 | 71 |
| 2026 | 37 | 152 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/1105Heating or thermal processing not related to soldering, firing, curing or laminatingIndexing code711
- H05K 2203/1189Pressing leads, bumps or a die through an insulating layerIndexing code342
- H05K 2203/1131Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivityIndexing code320
- H05K 2203/1147Sealing or impregnatingIndexing code224
- H05K 2203/1178Means for venting or for letting gases escapeIndexing code218
- H05K 2203/1157Using means for chemical reductionIndexing code179
- H05K 2203/1173Differences in wettabilityIndexing code177
- H05K 2203/1115Resistance heatingIndexing code139
All 18 subgroupsShow fewer
- H05K 2203/1152Replicating the surface structure of a sacrificial layerIndexing code135
- H05K 2203/1184UnderetchingIndexing code127
- H05K 2203/1121CoolingIndexing code115
- H05K 2203/1126Firing, i.e. heating a powder or paste above the melting temperature ofIndexing code112
- H05K 2203/111PreheatingIndexing code99
- H05K 2203/1163Chemical reactionIndexing code86
- H05K 2203/1142Conversion of conductive material into insulating material or into dissolvable compoundIndexing code85
- H05K 2203/1194Thermal treatment leading to a different chemical state of a materialIndexing code61
- H05K 2203/1136Conversion of insulating material into conductive materialIndexing code59
- H05K 2203/1168Graft-polymerizationIndexing code25
Recent patents
- Laser folded 3D electronics29 Sep 2026US 12,750,950 B2The United States of America as represented by the Secretary of the Army
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,957 B2Avary Holding (Shenzhen) Co., Limited.
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Photosensitive resin composition, resin film having pattern, method for producing resin film having pattern, and semiconductor circuit board24 Sep 2026US 2026/0292972 A1Jsr Corporation
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same17 Sep 2026US 2026/0282213 A1Corning Incorporated
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom286US 6,036,099 A2000
- Method of manufacturing a thin-film pattern on a substrate253US 5,259,926 AHitachi, Ltd. · 1993
- Structure for semiconductor package for improving the efficiency of spreading heat241US 5,903,052 AIndustrial Technology Research Institute · 1999
- Flip chip technology using electrically conductive polymers and dielectrics219US 5,074,947 AEpoxy Technology, Inc. · 1991