H05K 2203/1189
Pressing leads, bumps or a die through an insulating layer
H05K2203/1189 (Pressing leads, bumps or a die through an insulating layer) appears on 342 US grants and 316 published applications in this corpus.
Search patents in H05K- Granted patents
- 342
- Published applications
- 316
- Assignees
- 171
- Inventors
- 854
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 7 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 7 | 0 |
| 1993 | 11 | 0 |
| 1994 | 12 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 10 | 0 |
| 2000 | 12 | 0 |
| 2001 | 10 | 4 |
| 2002 | 13 | 14 |
| 2003 | 20 | 24 |
| 2004 | 13 | 21 |
| 2005 | 18 | 43 |
| 2006 | 12 | 25 |
| 2007 | 25 | 27 |
| 2008 | 16 | 34 |
| 2009 | 15 | 29 |
| 2010 | 18 | 20 |
| 2011 | 14 | 15 |
| 2012 | 14 | 15 |
| 2013 | 5 | 5 |
| 2014 | 8 | 2 |
| 2015 | 5 | 2 |
| 2016 | 1 | 3 |
| 2017 | 3 | 6 |
| 2018 | 6 | 2 |
| 2019 | 2 | 5 |
| 2020 | 7 | 3 |
| 2021 | 0 | 3 |
| 2022 | 3 | 2 |
| 2023 | 1 | 4 |
| 2024 | 4 | 5 |
| 2025 | 2 | 1 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Carrier assembly and method for producing a carrier assembly21 Apr 2026US 12,610,474 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Electrical terminal, system and associated methods7 Oct 2025US 12,438,259 B2Agc Glass Europe
- Display device and method of manufacturing the same11 Mar 2025US 12,249,591 B2Samsung Display Co., Ltd.
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Flexible die-cut circuit board and method of manufacturing same30 Apr 2026US 2026/0122777 A1SK On Co., Ltd.
- Flexible printed circuit board, display device comprising the same, method for manufacturing the same, and electronic device comprising the same25 Dec 2025US 2025/0393125 A1Samsung Display Co., Ltd.
- Printed Circuit Board, Manufacturing Method Thereof, and Battery Pack Including the Same28 Nov 2024US 2024/0397616 A1LG Energy Solution, Ltd.
- Manufacturing a Component Carrier by a Nano Imprint Lithography Process14 Nov 2024US 2024/0381538 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Method of manufacturing a thin-film pattern on a substrate253US 5,259,926 AHitachi, Ltd. · 1993
- Flip chip technology using electrically conductive polymers and dielectrics219US 5,074,947 AEpoxy Technology, Inc. · 1991
- Flip chip bonding method using electrically conductive polymer bumps194US 5,196,371 AEpoxy Technology, Inc. · 1993
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Flip chip technology using electrically conductive polymers and dielectrics167US 5,237,130 AEpoxy Technology, Inc. · 1993