Flip chip technology using electrically conductive polymers and dielectrics
AssigneeEpoxy Technology, Inc.
InventorsFrank W. Kulesza, Richard H. Estes
Life of this patent
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Abstract
A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Monomer is formed on the bond pads extending to a level beyond the organic protective layer to form bumps. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The bumps can be polymerized either before or after contacting the bumps to the bond pads of the substrate to form electrically conductive interconnections between the bond pads of the flip chip and the bond pads of the substrate.
Claims18
A bumped substrate, comprising:
- a) an electrical contact at a surface of the substrate;
- b) an organic protective coating disposed on the surface of the substrate and extending about the electrical contact;
- and
- c) a bump disposed at the electrical contact, the bump including at least two layers, each of said layers being formed of an electrically-conductive polymer or a monomer which, upon polymerization, forms a electrically-conductive polymer.
An electrical circuit, comprising:
- a) a first substrate which includes at least one electrical contact disposed at a surface of said first substrate;
- b) an organic protective coating disposed on the surface and extending about the electrical contact of the first substrate;
- c) a second substrate which includes at least one electrical contact disposed at a surface of said second substrate;
- and
- d) an interconnection disposed between an electrical contact of said first substrate and an electrical contact of said second substrate, the interconnection including at least two layers, each of said layers being formed of an electrically-conductive polymer or a monomer which, upon polymerization, forms an electrically-conductive polymer.
A bumped substrate, formed by a method, comprising the steps of:
- a) selectively forming an organic protective layer on a surface of the substrate, leaving an electrical contact of the first substrate exposed;
- b) disposed a first layer of an electrically-conductive polymer or monomer on the electrical contact of said substrate;
- and
- c) disposing a second layer of an electrically conductive polymer or monomer on said first layer, the first and second layers forming an electrically-conductive bump.
An article which includes an electrical interconnection between electrical contacts of first and second substrates, formed by a method comprising the steps of:
- a) selectively forming an organic protective layer over a surface of the first substrate, leaving an electrical contact on the first substrate exposed;
- b) disposing a first layer of an electrically-conductive polymer or monomer on the electrical contact of said first substrate;
- c) disposing a second layer of the electrically-conductive polymer or monomer on said first layer, the first and second layers together forming an electrically-conductive bump;
- and
- d) contacting the electrically-conductive bump with an electrical contact of the second substrate, thereby forming an electrical interconnection between the electrical contacts of the first and second substrates.
Dependencies are inferred from the claim text.