H05K 2203/1178
Means for venting or for letting gases escape
H05K2203/1178 (Means for venting or for letting gases escape) appears on 218 US grants and 219 published applications in this corpus.
Search patents in H05K- Granted patents
- 218
- Published applications
- 219
- Assignees
- 148
- Inventors
- 499
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 9 | 0 |
| 2000 | 5 | 0 |
| 2001 | 8 | 6 |
| 2002 | 10 | 12 |
| 2003 | 11 | 10 |
| 2004 | 7 | 6 |
| 2005 | 4 | 14 |
| 2006 | 9 | 7 |
| 2007 | 7 | 12 |
| 2008 | 6 | 19 |
| 2009 | 9 | 18 |
| 2010 | 7 | 14 |
| 2011 | 11 | 9 |
| 2012 | 6 | 3 |
| 2013 | 7 | 8 |
| 2014 | 3 | 8 |
| 2015 | 6 | 7 |
| 2016 | 12 | 13 |
| 2017 | 8 | 7 |
| 2018 | 6 | 7 |
| 2019 | 6 | 7 |
| 2020 | 14 | 11 |
| 2021 | 3 | 3 |
| 2022 | 8 | 0 |
| 2023 | 1 | 6 |
| 2024 | 3 | 5 |
| 2025 | 4 | 4 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board module and method for manufacturing same4 Aug 2026US 12,701,659 B2Samsung Electronics Co., Ltd.
- Printed circuit board, battery module, battery pack, and electrical device5 May 2026US 12,620,635 B2Contemporary Amperex Technology (Hong Kong) Limited
- Support pin for supporting a substrate in a placement area of a placement machine18 Nov 2025US 12,477,710 B2ASMPT GmbH & Co. KG
- Electronic devices including vent openings and associated methods17 Jun 2025US 12,334,405 B2Infineon Technologies AG
- Panel molded electronic assemblies with integral terminals14 Jan 2025US 12,200,862 B1Vicor Corporation
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Substrate carrier and motor vehicle23 Jul 2026US 2026/0214788 A1Hella GmbH & Co. KGaA
- Printed circuit board assembly including interposer circuit16 Apr 2026US 2026/0107371 A1Samsung Electronics Co., Ltd.
- Carrier arrangement, optoelectronic component with carrier arrangement and method for producing an optoelectronic component with carrier arrangement25 Sep 2025US 2025/0300424 A1
- Systems and methods for automated degassing during the manufacturing of a high speed design12 Jun 2025US 2025/0194019 A1Advanced Micro Devices, Inc.
Most cited
By later US patents
- Structure for semiconductor package for improving the efficiency of spreading heat241US 5,903,052 AIndustrial Technology Research Institute · 1999
- PCB design and method for providing vented blind vias122US 6,787,443 B1Intel Corporation · 2004
- Vented vias for via in pad technology yield improvements61US 6,580,174 B2Intel Corporation · 2003
- Eclipse via in pad structure58US 5,875,102 AIntel Corporation · 1999
- Circuit board assembly and method of manufacturing the same57US 4,139,881 AMatsushita Electric Industrial Co., Ltd. · 1979