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US 6,580,174 B2Granted
Vented vias for via in pad technology yield improvements
AssigneeIntel Corporation
InventorsCarolyn R. McCormick, Rebecca A. Jessep, John H. Dungan, David W. Boggs, Daryl A. Sato
Life of this patent
Estimating the term…
Abstract
An apparatus that includes a substrate, one or more via in pads in the substrate; and one or more vents in at least one of the one or more via in pads, the one or more vents connecting an outer diameter of at least one of the one or more via in pads to a diameter larger than the via.
Claims13
An apparatus, comprising:
- a substrate;
- one or more via in pads in the substrate;
- and
- one or more vents in at least one of the one or more via in pads, the one or more vents connecting an outer diameter of at least one of the one or more via in pads to a diameter larger than the via.
1 more element
An apparatus, comprising:
- a substrate;
- one or more via in pads in the substrate;
- and
- one or more vents in at least one of the one or more via in pads, at least one of the one or more vents having a cross-sectional area that varies as the vent progresses toward the outer diameter of the one or more via in pads.
1 more element
The apparatus, comprising:
- a first substrate, comprising:
- a plurality of via in pads containing a plurality of vents, the one or more vents connecting an outer diameter of at least one of the plurality of via in pads to a diameter larger than the via;
- a second substrate;
- comprising
- a plurality of lands, wherein one or more of the plurality of lands are connected to one or more of the via in pads by one or more solder balls, and the plurality of vents so connected are capable of releasing outgassing from the plurality of via in pads.
2 more elements
Dependencies are inferred from the claim text.