Panel molded electronic assemblies with integral terminals

Apparatus comprising:

• an over-molded electronic module including:
• a multilayer printed circuit board (“PCB”) having alternating electrically conductive layers and insulating layers in a thickness direction, a first plurality of electronic components mounted to a first surface of the PCB;
• a first layer of cured encapsulant covering the first plurality of components and the first surface of the PCB, the first layer of cured encapsulant forming a first exterior module surface, wherein the cured encapsulant is composed of cured molding compound, the molding compound prior to being cured is suitable to being injected into a mold that defines an upper surface contour of the first layer of cured encapsulant, and the cured encapsulant is composed of a material different from the insulating layers of the PCB;
• one or more conductive features buried beneath the first exterior module surface;
• one or more terminal holes formed in the first layer of cured encapsulant, each terminal hole intersecting a respective set of the conductive features to expose respective portions of the selected set of the conductive features;
• and
• one or more conductive terminals, wherein each conductive terminal has a first portion that extends beyond the first exterior module surface and a second portion disposed within the terminal hole and electrically connected to the respective portions of the respective set of conductive features;
• wherein each respective conductive terminal is electrically connected to the respective portions of the one or more conductive features exposed within the respective terminal holes and forms a pressure fit with conductive features in the respective terminal holes.