Printed circuit board assembly including interposer circuit
AssigneeSamsung Electronics Co., Ltd.
InventorsJongyeon KIM, Eunsoo PARK, Kyungsoo JANG, Junsoo LEE, Yongwoon KIM
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AssigneeSamsung Electronics Co., Ltd.
InventorsJongyeon KIM, Eunsoo PARK, Kyungsoo JANG, Junsoo LEE, Yongwoon KIM
Estimating the term…
A printed circuit board assembly is provided. The printed circuit board assembly includes a first printed circuit board, a second printed circuit board, a first interposer circuit at least partially surrounding a first space between the first printed circuit board and the second printed circuit board, and a thermally conductive material arranged within the first space, wherein the first interposer circuit has a first ventilation path, wherein the first ventilation path connects a first end formed at an outer side, facing the outside, of the first portion of the first interposer circuit and a second end formed at an inner side, facing the first space, of the first portion, and wherein the length of the first ventilation path is greater than the width of a part of the first interposer circuit in which the first ventilation path is formed.
A printed circuit board assembly comprising:
A printed circuit board assembly comprising:
Dependencies are inferred from the claim text.