US 12,701,659 B2 · Circuit board module and method for manufacturing same

Abstract

A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.

Claims13

Dependent claims

An electronic device comprising:

a housing comprising a front side and a rear side;
and
a circuit board module, provided in the housing between the front side and the rear side, the circuit board module comprising:
a first printed circuit board (PCB);
a second PCB comprising an inlet;
an interposer configured to electrically connect the first PCB and the second PCB, and providing a space between the first PCB and the second PCB;
and
a filler provided in the space and configured to dissipate heat,
wherein the inlet is configured such that the filler is injectable through the inlet,
wherein the electronic device further comprises a second opening on at least one of the first PCB, the second PCB, or the interposer, the second opening being configured to allow air to be exhausted from the space while the filler is being injected into the space, and
wherein the second opening is at a position at which no filler is provided.

8 more elements

Dependencies are inferred from the claim text.

Circuit board module and method for manufacturing same

Life of this patent

Circuit board module and method for manufacturing same

Life of this patent

Abstract

Claims13