H05K 2203/1142
Conversion of conductive material into insulating material or into dissolvable compound
H05K2203/1142 (Conversion of conductive material into insulating material or into dissolvable compound) appears on 85 US grants and 78 published applications in this corpus.
Search patents in H05K- Granted patents
- 85
- Published applications
- 78
- Assignees
- 58
- Inventors
- 204
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 0 |
| 2003 | 4 | 6 |
| 2004 | 1 | 8 |
| 2005 | 3 | 3 |
| 2006 | 3 | 7 |
| 2007 | 1 | 6 |
| 2008 | 2 | 5 |
| 2009 | 4 | 5 |
| 2010 | 4 | 3 |
| 2011 | 1 | 5 |
| 2012 | 6 | 2 |
| 2013 | 2 | 1 |
| 2014 | 3 | 10 |
| 2015 | 2 | 6 |
| 2016 | 3 | 1 |
| 2017 | 4 | 2 |
| 2018 | 2 | 2 |
| 2019 | 2 | 2 |
| 2020 | 2 | 1 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board structure and manufacturing method thereof10 Feb 2026US 12,550,246 B2Unimicron Technology Corp.
- Optimization of high resolution digitally encoded laser scanners for fine feature marking30 Jan 2024US 11,888,084 B2nLIGHT, Inc.
- Optimization of high resolution digitally encoded laser scanners for fine feature marking9 Aug 2022US 11,411,132 B2nLIGHT, Inc.
- Optimization of high resolution digitally encoded laser scanners for fine feature marking23 Jun 2020US 10,692,620 B2nLIGHT, Inc.
- Optimization of high resolution digitally encoded laser scanners for fine feature marking11 Feb 2020US 10,559,395 B2nLIGHT, Inc.
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Circuit board structure and manufacturing method thereof30 May 2024US 2024/0179829 A1Unimicron Technology Corp.
- Optimization of high resolution digitally encoded laser scanners for fine feature marking9 Feb 2023US 2023/0039104 A1nLIGHT, Inc.
- Optimization of high resolution digitally encoded laser scanners for fine feature marking6 Aug 2020US 2020/0251237 A1nLIGHT, Inc.
- Patterned electrode, method for forming patterned electrode and display device4 Jul 2019US 2019/0206586 A1Boe Technology Group Co., Ltd.
Most cited
By later US patents
- Substrate for electronic packaging, pin jig fixture105US 6,448,510 B1Micro Components Ltd. · 2002
- Anisotropic conductive material body, display apparatus, method for producing the display apparatus, and conductive member70US 7,134,879 B2Sharp Kabushiki Kaisha · 2006
- High temperature reaction apparatus62US 5,552,675 A1996
- Reaction apparatus and method59US 5,131,941 A1992
- Method for fabricating an inorganic resistor58US 7,553,512 B2Cabot Corporation · 2009