H05K 2203/1168
Graft-polymerization
H05K2203/1168 (Graft-polymerization) appears on 25 US grants and 24 published applications in this corpus.
Search patents in H05K- Granted patents
- 25
- Published applications
- 24
- Assignees
- 20
- Inventors
- 62
- Latest grant
- 2 Mar 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
| 2002 | 0 | 0 |
| 2003 | 2 | 2 |
| 2004 | 0 | 0 |
| 2005 | 2 | 3 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 2 | 3 |
| 2009 | 0 | 5 |
| 2010 | 2 | 4 |
| 2011 | 1 | 1 |
| 2012 | 1 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 3 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 2 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Metal coating of objects using plasma polymerisation pretreatment2 Mar 2021US 10,934,617 B2Cuptronic Technology Ltd.
- Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate15 May 2018US 9,972,413 B2Dai Nippon Printing Co.Ltd.
- Dispersant, metal particle dispersion for electroconductive substrates, and method for producing electroconductive substrate24 Apr 2018US 9,953,740 B2Dai Nippon Printing Co.Ltd.
- Substrate with metal film and method for manufacturing the same22 Oct 2013US 8,563,873 B2Ibiden Co., Ltd.
- Method for forming metal pattern, metal pattern and printed wiring board11 Sep 2012US 8,261,438 B2FUJIFILM Corporation
- Component Carrier With Photosensitive Adhesion Promoter and Method of Manufacturing the Same11 Jul 2024US 2024/0237230 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printing Method for Fabrication of Printed Electronics1 Dec 2016US 2016/0353578 A1
- Dispersant, metal particle dispersion for electroconductive substrates, and method for producing electroconductive substrate22 Oct 2015US 2015/0299364 A1Dai Nippon Printing Co.Ltd.
- Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate1 Oct 2015US 2015/0279505 A1Dai Nippon Printing Co.Ltd.
- Organic-inorganic hybrid material film and method for manufacturing the same5 Feb 2015US 2015/0038039 A1Iteq Corporation
Most cited
By later US patents
- Conductive elastomer for grafting to thermoplastic and thermoset substrates71US 6,180,221 B2Thomas & Betts International, Inc. · 2001
- Modification of polymer surfaces55US 5,051,312 AE. I. Du Pont de Nemours and Company · 1991
- Conductive elastomer for grafting to a metal substrate43US 5,977,489 AThomas & Betts International, Inc. · 1999
- Conductive elastomers and methods for fabricating the same37US 5,949,029 AThomas & Betts International, Inc. · 1999
- Electrical contact having a particulate surface33US 5,527,591 AAugat Inc. · 1996