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US 2016/0353578 A1Published application
Printing Method for Fabrication of Printed Electronics
OwnerJun Yang, Xiaolong Wang +2inventors
InventorsJun Yang, Xiaolong Wang, Tengyuan Zhang, Qiuquan Guo
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Abstract
This invention relates to fabrication of high quality printed electronics, particularly without the use of conductive inks, on various substrates by printing catalyst based inks followed by electroless deposition of metals. A method comprising substrate surface modification, preparing catalyst based inks, electroless deposition of a thick layer of metal and post-printing treatment is disclosed.
Claims16
A method of fabricating electronics on substrates by printing catalyst based ink as seeds for electroless deposition, the method comprising:
- I. Modifying substrates with functional groups, like polyelectrolytes, wherein the polyelectrolytes have quaternary ammonium groups;
- II. Applying catalyst based ink onto the substrate, e.g., by a printing method;
- III. Electroless deposition of metals;
- IV. Post-printing treatment like thermal sintering, inductive sintering or sintering by pulsed light
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Dependencies are inferred from the claim text.