Method for forming metal pattern, metal pattern and printed wiring board
AssigneeFUJIFILM Corporation
InventorKazuhiko Matsumoto
Life of this patent
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Abstract
The present invention provides a method for forming a metal pattern comprising a step of forming a polymer layer on a substrate; (a2) a step of applying a metal ion or the like to the polymer layer; (a3) a step of forming a conductive layer by reducing the metal ion or the like; (a4) a step of forming a patterned resist layer on the conductive layer; (a5) a step of forming a metal pattern by electroplating in the regions where the resist layer is not formed; (a6) a step of separating the resist layer; (a7) a step of removing the conductive layer from regions protected by the resist layer; and (a8) a step of performing a hydrophobilizing treatment.
Claims9
A method for forming a metal pattern comprising:
- (a1) a step of providing, on a substrate, a polymer layer that comprises a polymer containing a functional group that interacts with a metal ion or a metal salt, the polymer directly chemically bonding to the substrate;
- (a2) a step of applying a metal ion or a metal salt to the polymer layer;
- (a3) a step of reducing the metal ion or the metal salt to form a conductive layer having a surface resistivity of from 5 Ω/square to 100 kΩ/square;
- (a4) a step of forming a pattern-shaped resist layer on the conductive layer having a surface resistivity of from 5 Ω/square to 100 kΩ/square;
- (a5) a step of forming, in a region where the resist layer is not formed, a metal pattern by electroplating;
- (a6) a step of separating the resist layer;
- (a7) a step of removing the conductive layer formed in the step (a3) from a region that has been protected by the resist layer;
- and
- (a8) a step of performing a hydrophobilizing treatment at the polymer layer that has been provided in the step (a1) and that is present in the region from which the conductive layer has been removed in the step (a7).
Dependencies are inferred from the claim text.