H05K 2203/1194
Thermal treatment leading to a different chemical state of a material
Official title: Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
H05K2203/1194 (Thermal treatment leading to a different chemical state of a material) appears on 61 US grants and 173 published applications in this corpus.
Search patents in H05K- Granted patents
- 61
- Published applications
- 173
- Assignees
- 70
- Inventors
- 232
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 1 |
| 2007 | 2 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 6 |
| 2014 | 3 | 3 |
| 2015 | 1 | 12 |
| 2016 | 6 | 5 |
| 2017 | 5 | 5 |
| 2018 | 7 | 8 |
| 2019 | 6 | 5 |
| 2020 | 4 | 5 |
| 2021 | 7 | 5 |
| 2022 | 2 | 3 |
| 2023 | 1 | 2 |
| 2024 | 7 | 3 |
| 2025 | 0 | 5 |
| 2026 | 1 | 99 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,957 B2Avary Holding (Shenzhen) Co., Limited.
- Wiring board and method for manufacturing wiring board3 Dec 2024US 12,160,949 B2FUJIFILM Corporation
- Hermetic metallized via with improved reliability29 Oct 2024US 12,131,985 B2Corning Incorporated
- Insulated circuit board10 Sep 2024US 12,089,342 B2Mitsubishi Materials Corporation
- Flexible laminated board and multilayer circuit board14 May 2024US 11,985,762 B2Ube Exsymo Co., Ltd.
- Photosensitive resin composition, resin film having pattern, method for producing resin film having pattern, and semiconductor circuit board24 Sep 2026US 2026/0292972 A1Jsr Corporation
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same17 Sep 2026US 2026/0282213 A1Corning Incorporated
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
Most cited
By later US patents
- Composites of powdered fillers and polymer matrix27US 6,391,082 B1Holl Technologies Company · 2002
- Poly(arylene sulfide) printed circuit boards14US 4,532,015 APhillips Petroleum Company · 1985
- Method of manufacture of an interconnect stress test coupon13US 5,701,667 ADigital Equipment Corporation · 1997
- Structures for z-axis interconnection of multilayer electronic substrates12US 9,545,017 B2Integral Technology, Inc. · 2017
- Interconnect stress test coupon10US 5,451,885 ADigital Equipment Corporation · 1995