Poly(arylene sulfide) printed circuit boards
AssigneePhillips Petroleum Company
InventorsHarold D. Boultinghouse, Paul J. Boeke, Robert E. Benefield, Jr., John Leland
Life of this patent
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Abstract
A printed circuit board is made of poly(arylene sulfide) board and a conductive metal deposited on the board by electroless plating. Adhesion between the poly(arylene sulfide) and the conductive metal is improved by allowing the plated poly(arylene sulfide) to age.
Claims34
A method for obtaining improved adhesion between a conductive metal and a poly(arylene sulfide) substrate comprising (a) depositing said conductive metal onto said poly(arylene sulfide) substrate by electroless plating, and (b) aging the plated substrate produced in (a) for a time sufficient for the adhesion between said conductive metal and said poly(arylene sulfide) substrate as tested by peel strength immediately after the electroless plating to improve significantly.
In a process for the production of a printed circuit board the improvement comprising including in said process the steps of:
- (i) depositing a conductive metal onto a poly(arylene sulfide) board by electroless plating;
- (ii) electroplating additional conductive metal onto the conductive metal deposited in accordance with step (i);
- and
- (iii) after completion of step (ii) allowing the plated board to age until the adhesion between said conductive metal and said poly(arylene sulfide) board is sufficiently strong such that the peel strength associated therewith is at least about 4 pounds per inch as measured in accordance with ASTM Test Method Part 9 B 533-79 Procedure A.
A process for the production of a printed circuit board comprising
- (a) etching a poly(arylene sulfide) board with a chemical etchant,
- (b) depositing a conductive metal onto preselected portions of said poly(arylene sulfide) board by electroless plating to form the circuitry of said printed circuit board, and
- (c) allowing the plated board to age until the adhesion between said conductive metal and said poly(arylene sulfide) board is at least about 4 pounds per inch as measured in accordance with ASTM Test Method Part 9 B 533-79 Procedure A.
A process for the production of a printed circuit board comprising
- (a) etching a poly(arylene sulfide) board with a chemical etchant,
- (b) depositing a conductive metal onto said poly(arylene sulfide) board by electroless plating;
- wherein at some time subsequent to said electroless plating a portion of said conductive metal is removed from said board leaving the remaining conductive metal in the form of the desired circuitry of said printed circuit board, and
- (c) allowing the plated board to age until the adhesion between said conductive metal and said poly(arylene sulfide) board is at least about 4 pounds per inch as measured in accordance with ASTM Test Method Part 9 B 533-79 Procedure A.
A method for obtaining improved adhesion between a conductive metal and a poly(arylene sulfide) substrate comprising (a) depositing said conductive metal onto said poly(arylene sulfide) substrate by electroless plating wherein the metal to substrate adhesion as measured immediately after the electroless plating is below about 4 pounds per inch, and (b) aging the plated substrate produced in (a) for a time sufficient for the adhesion between said conductive metal and said poly(arylene sulfide) substrate to increase to at least about 4 pounds per inch.
Dependencies are inferred from the claim text.