Method of manufacture of an interconnect stress test coupon

Abstract

This disclosure describes an Interconnect Stress Testing (IST) system and a printed wiring board test coupon which is used with the IST system. The system includes a computer device and a cabinet which is used for mounting the test coupon as well as housing a number of the other components that make up the system. During a pre-cycling phase, the system determines the correct current that should be passed through the coupon in order to heat it to a predetermined temperature. After that test current value is determined the system actually stress tests the coupon by passing the determined test current through the coupon. It does so for a selected number of cycles, and monitors resistance changes in the coupon during testing while recording test data. This disclosure also describes the test coupon, which is designed to uniformly dissipate the heat created during stress cycling.

Dependencies are inferred from the claim text.