US 12,750,957 B2 · Circuit board and manufacturing method thereof

Abstract

A circuit board includes a glass substrate, a wiring layer, an electronic component, a first build-up structure and a second build-up structure. The glass substrate has a first surface, a second surface opposite to the first surface, and a conductive through hole connecting to the first surface and the second surface. The melting point of the glass substrate is not greater than 600° C. and is greater than the temperature of soldering. The wiring layer and the electronic component are disposed in the glass substrate. The first layer build-up structure is disposed on the first surface and is electrically connected to the conductive through hole. The second build-up structure is disposed on the second surface and is electrically connected to the conductive through hole.

Claims17

Dependent claims

A circuit board, comprising:

a glass substrate, having a first surface, a second surface opposite to the first surface, and a conductive through hole connecting to the first surface and the second surface, wherein a melting point of the glass substrate is not greater than 600° C. and is greater than a temperature of soldering;
a wiring layer, disposed in the glass substrate;
an electronic component, disposed in the glass substrate;
a first build-up structure, disposed on the first surface and electrically connected to the conductive through hole;
and
a second build-up structure, disposed on the second surface and electrically connected to the conductive through hole.

3 more elements

A method of manufacturing a circuit board, comprising:

forming a first wiring layer on a release substrate;
disposing the release substrate in a first mold after the first wiring layer is formed on the release substrate;
filling the first mold with a first molten glass material after the release substrate is disposed in the first mold;
annealing the first molten glass material to form an initial glass substrate;
removing the first mold after the first molten glass material is annealed to form the initial glass substrate;
forming a second wiring layer on the initial glass substrate;
mounting an electronic component on the second wiring layer after the second wiring layer is formed on the initial glass substrate;
disposing the release substrate and the initial glass substrate in a second mold after the electronic component is mounted on the second wiring layer;
filling the second mold with a second molten glass material after the release substrate and the initial glass substrate are disposed in the second mold;
annealing the second molten glass material to form a glass substrate, wherein a melting point of the glass substrate is greater than a temperature of soldering;
and
removing the second mold and the release substrate after the second molten glass material is annealed to form the glass substrate.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/671,592Filed 22 May 2024

Published

US 2025/0365872 A127 Nov 2025

Granted

29 Sep 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

H05K 3/4644
Manufacturing multilayer circuits: by building the multilayer layer by layer, i.e. build-up multilayer circuits
H05K 1/0306
Use of materials for the substrate: inorganic insulating substrates, e.g. ceramic, glass
H05K 3/4038
Forming printed elements for providing electric connections to or between printed circuits: through-connections; Vertical interconnect access…
H05K 3/4605
Characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are…:…

Circuit board and manufacturing method thereof

Life of this patent

Circuit board and manufacturing method thereof

Life of this patent

Abstract

Claims17