Insulated circuit board
AssigneeMitsubishi Materials Corporation
InventorsAkira Sakurai, Nobuyuki Terasaki
Life of this patent
Estimating the term…
Abstract
In an insulating circuit substrate, aluminum sheets formed of aluminum or an aluminum alloy are laminated and bonded to a surface of a ceramic substrate and, in the aluminum sheets, Cu is solid-solubilized at a bonding interface with the ceramic substrate and a ratio B/A between a Cu concentration A mass % at the bonding interface and a Cu concentration B mass % at a position of 100 μm in a thickness direction from the bonding interface to the aluminum sheets side is 0.30 or more and 0.85 or less.
Claims20
An insulating circuit substrate in which an aluminum sheet formed of aluminum or an aluminum alloy is laminated and bonded to a surface of a ceramic substrate,
- wherein, in the aluminum sheet, Cu is solid-solubilized at a bonding interface with the ceramic substrate, and a ratio B/A between a Cu concentration A mass % at the bonding interface and a Cu concentration B mass % at a position of 100 μm in a thickness direction from the bonding interface to the aluminum sheet side is 0.30 or more and 0.85 or less.
Dependencies are inferred from the claim text.