Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same

A microelectronic article, the microelectronic article comprising:

• a glass-based substrate comprising a first surface and a second surface opposite the first surface;
• a metallized through glass via extending from the first surface to the second surface of the glass-based substrate;
• at least one redistribution layer disposed on the first surface, the second surface, or both, wherein:
• the glass-based substrate comprises a compressive layer at the first surface of the glass-based substrate, the second surface of the glass-based substrate, an edge of the glass-based substrate, and a sidewall of the at least one through glass via.

A method of making a microelectronic article, the method comprising:

• forming at least one through glass via in a glass-based substrate;
• laser perforating nanoperforations in the glass-based substrate, wherein the nanoperforations define a contour of a die circumscribing the at least one through glass via;
• strengthening the glass-based substrate;
• metallizing the at least one through glass via;
• disposing at least one redistribution layer on the glass-based substrate;
• and
• singulating the die from the glass-based substrate to form the microelectronic article.