Interconnect stress test coupon

A printed wiring board coupon comprising:

• a substrate;
• and
• a plurality of vias, said vias comprising electrically interconnected test vias which are arranged in said substrate in first and second rows such that the heat dissipated when a stress test current is applied to said first row of test vias does not contribute to the heating of said second row of test vias, the first and second rows of test vias thereby remaining thermally isolated from one another.

A printed wiring board panel comprising:

• a printed wiring board formed on a substrate and including a plurality of conductive board vias;
• and
• a test coupon formed on the same substrate as said board, said coupon including a plurality of electrically interconnected test vias which are arranged in said substrate such that when a stress test current is applied to said test vias, the heat dissipated by each said test via does not contribute to the heating of the other test vias, the test vias thereby remaining thermally isolated from one another.

A printed wiring board coupon comprising:

• a substrate;
• and
• a plurality of vias, said vias comprising electrically interconnected test vias which are arranged in said substrate in first and second rows such that the heat dissipated when a stress test current is applied to said first row of test vias does not contribute to the heating of said second row of test vias, the first and second rows of test vias thereby remaining thermally isolated from one another such that the temperature of any test via during the application of the stress test current does not vary more that .+-.5.degree. C. from the temperature of the other test vias.