H05K 2203/1184
Underetching
Official title: Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
H05K2203/1184 (Underetching) appears on 127 US grants and 109 published applications in this corpus.
Search patents in H05K- Granted patents
- 127
- Published applications
- 109
- Assignees
- 76
- Inventors
- 263
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 7 |
| 2002 | 7 | 6 |
| 2003 | 4 | 6 |
| 2004 | 7 | 3 |
| 2005 | 3 | 4 |
| 2006 | 0 | 2 |
| 2007 | 5 | 9 |
| 2008 | 3 | 6 |
| 2009 | 2 | 5 |
| 2010 | 4 | 8 |
| 2011 | 4 | 4 |
| 2012 | 6 | 2 |
| 2013 | 2 | 1 |
| 2014 | 4 | 3 |
| 2015 | 4 | 8 |
| 2016 | 6 | 6 |
| 2017 | 6 | 4 |
| 2018 | 5 | 3 |
| 2019 | 2 | 3 |
| 2020 | 3 | 6 |
| 2021 | 6 | 6 |
| 2022 | 5 | 2 |
| 2023 | 2 | 2 |
| 2024 | 1 | 2 |
| 2025 | 2 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring substrate24 Feb 2026US 12,563,664 B2Ibiden Co., Ltd.
- Interconnect structure for insertion loss reduction in signal transmission and method thereof22 Apr 2025US 12,283,488 B2Yuan Ze University
- Printed circuit board and method of fabricating the same18 Feb 2025US 12,232,273 B2LG Innotek Co., Ltd.
- Printed circuit board and method of manufacturing the same30 Jan 2024US 11,889,634 B2LG Innotek Co., Ltd.
- Flexible electronic structure and method for producing same7 Nov 2023US 11,812,559 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Circuit board30 Jan 2025US 2025/0040032 A1LG Innotek Co., Ltd.
- Component Carrier and Method Manufacturing the Same3 Oct 2024US 2024/0334613 A1AT&S (Chongqing) Company Limited
- Impedence Matching Conductive Structure for High Efficiency RF Circuits11 Jan 2024US 2024/0014794 A13D Glass Solutions, Inc.
- Wiring substrate21 Dec 2023US 2023/0413429 A1Ibiden Co., Ltd.
- Printed circuit board and method of fabricating the same19 Oct 2023US 2023/0337370 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Flex circuit substrate for an integrated circuit package60US 6,365,974 B1Texas Instruments Incorporated · 2002
- Process for bonding metals to electrophoretically deposited resin coatings54US 4,601,916 AKollmorgen Technologies Corporation · 1986
- Process for the production of printed circuit boards with extremely dense wiring using a metal-clad laminate51US 5,436,062 ADyconex Patente AG · 1995
- Processes for electrically conductive decals filled with inorganic insulator material47US 5,108,541 AInternational Business Machines Corporation · 1992
- Flexible automated bonding method and apparatus47US 5,127,570 ACray Research, Inc. · 1992