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US 2023/0337370 A1Published application
Printed circuit board and method of fabricating the same
AssigneeLG Innotek Co., Ltd.
InventorsYun Mi BAE, Soon Gyu KWON, Sang Hwa KIM, Sang Young LEE, Jin Hak LEE, Han Su LEE, Dong Hun JEONG, In Ho JEONG, Dae Young CHOI, Jung Ho HWANG
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Abstract
A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
Claims1
A circuit board comprising:
- an insulating layer;
- a first metal layer disposed on the insulating layer;
- and
- a second metal layer disposed on the first metal layer,
- wherein the first metal layer includes:
- an upper surface in contact with the second metal layer,
- a lower surface facing the insulating layer, and
- a side surface disposed between the upper surface and the lower surface.
5 more elements
Dependencies are inferred from the claim text.