Flexible automated bonding method and apparatus
AssigneeCray Research, Inc.
InventorsRichard R. Steitz, Melvin C. August, Diane M. Christie, Deanna M. Dowdle, Dean B. Dudley, Stephen E. Nelson, Eugene F. Neumann, Paul E. Schroeder
Life of this patent
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Abstract
A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.
Claims26
A Flexible Automated Bonding apparatus for electrical interconnection to a device, comprising:
- (a) a non-conducting, flexible substrate having first and second surfaces;
- (b) at least one metallized interconnect pattern on the first surface of said substrate having at lest one conductive path, said conductive path having a bottom surface in contact with the first surface of said substrate;
- (c) at least one aperture through the first and second surfaces of said substrate exposing a portion of said conductive path spanning at least a portion of each aperture for electrical interconnection of the exposed conductive path portion through said aperture to the device;
- and
- (d) bonding means for electrically connecting said metallized interconnect pattern through said aperture to a conductive element on the device when the second surface of the substrate is in contact with the device, said bonding means comprising said exposed conductive path portions which span at least a portion of said apertures.
A method of fabricating a Flexible Automated Bonding apparatus, comprising:
- (a) fabricating a metallized lead pattern on a first surface of a flexible, non-conducting substrate, said lead pattern comprised of at least one conductive path;
- (b) covering a second surface of said substrate with a metallized mask defining an aperture pattern, said aperture pattern identifying at least one aperture through said substrate underneath said conductive path;
- and
- (c) scanning said mask with laser light having an emission wavelength that does not damage said lead pattern and said mask, and further, so that said laser light ablates any areas of said substrate exposed by said aperture pattern.
A method for attaching integrated circuit carriers to printed circuit boards using a flexible automated bonding substrate having first and second surfaces with metallized interconnects on the first surface and apertures formed through the first and second surfaces of the substrate to expose a bottom surface of a portion of the metallized interconnects, the method comprising:
- (a) attaching the carrier to the printed circuit board;
- (b) placing the second surface of the substrate in contact with the printed circuit board;
- (c) aligning apertures in the flexible automated bonding substrate and associated exposed portions of the metallized interconnects with corresponding elements on the printed circuit board;
- and
- (d) bonding the exposed portions of the metallized interconnects to the corresponding elements on the printed circuit board.
A method of aligning a Flexible Automated Bonding apparatus on a printed circuit board, comprising:
- (a) grossly aligning the Flexible Automated Bonding apparatus by matching at least one alignment aperture in a substrate with an alignment bump or alignment pin hole on a bonding surface or an alignment pin;
- and
- (b) finely aligning the Flexible Automated Bonding apparatus by matching at least one metallized interconnect aperture in said substrate with a bonding pad on said printed circuit board, thereby providing electrical connection between said metallized interconnect and said bonding pad.
Dependencies are inferred from the claim text.