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US 12,232,273 B2Granted
Printed circuit board and method of fabricating the same
AssigneeLG Innotek Co., Ltd.
InventorsYun Mi Bae, Soon Gyu Kwon, Sang Hwa Kim, Sang Young Lee, Jin Hak Lee, Han Su Lee, Dong Hun Jeong, In Ho Jeong, Dae Young Choi, Jung Ho Hwang
Life of this patent
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Abstract
A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
Claims20
A circuit board comprising:
- an insulating layer;
- a first metal layer disposed on the insulating layer;
- and
- a second metal layer disposed on the first metal layer such that the first metal layer is disposed between the second metal layer and the insulating layer,
- wherein the first metal layer includes:
- an upper surface in contact with the second metal layer;
- a lower surface opposite from the upper surface and facing the insulating layer;
- and
- a side surface disposed between the upper surface and the lower surface,
- wherein at least a part of the side surface of the first metal layer overlaps the second metal layer in a vertical direction,
- wherein the side surface of the first metal layer includes a curved portion,
- wherein the first metal layer includes a first portion in which a width of the first metal layer gradually increases in the vertical direction from the upper surface of the first metal layer toward the lower surface of the first metal layer,
- wherein the first portion of the first metal layer includes the curved portion of the side surface of the first metal layer, and
- wherein the first metal layer includes:
- a first region overlapped by the second metal layer in the vertical direction;
- and
- a second region that is not overlapped by the second metal layer in the vertical direction.
14 more elements
A circuit board comprising:
- an insulating layer;
- a first metal layer disposed on the insulating layer;
- a second metal layer disposed on the first metal layer;
- and
- a protective layer disposed on the insulating layer to cover a surface of the insulating layer,
- wherein the first metal layer includes:
- an upper surface in contact with the second metal layer;
- a lower surface opposite from the upper surface and facing the insulating layer;
- and
- a side surface disposed between the upper surface and the lower surface,
- wherein at least a part of the side surface of the first metal layer overlaps the second metal layer in a vertical direction,
- wherein the side surface of the first metal layer includes a curved portion, and
- wherein a width of the second metal layer is greater than a width of the upper surface of the first metal layer and smaller than a width of the lower surface of the first metal layer.
10 more elements
A circuit board comprising:
- an insulating layer;
- a first metal layer disposed on the insulating layer;
- a second metal layer disposed on the first metal layer;
- and
- a protective layer disposed on the insulating layer to cover a surface of the insulating layer,
- wherein the first metal layer includes:
- an upper surface in contact with the second metal layer;
- a lower surface opposite from the upper surface and facing the insulating layer;
- and
- a side surface disposed between the upper surface and the lower surface,
- wherein at least a part of the side surface of the first metal layer overlaps the second metal layer in a vertical direction,
- wherein the side surface of the first metal layer includes a curved portion, and
- wherein the protective layer is formed to cover the side surface of the first metal layer and a part of an upper surface of the second metal layer.
10 more elements
Dependencies are inferred from the claim text.