H05K 2203/1131
Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
H05K2203/1131 (Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity) appears on 320 US grants and 518 published applications in this corpus.
Search patents in H05K- Granted patents
- 320
- Published applications
- 518
- Assignees
- 257
- Inventors
- 1,077
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 3 |
| 2003 | 3 | 2 |
| 2004 | 1 | 5 |
| 2005 | 2 | 9 |
| 2006 | 1 | 9 |
| 2007 | 2 | 39 |
| 2008 | 3 | 14 |
| 2009 | 4 | 35 |
| 2010 | 8 | 19 |
| 2011 | 7 | 16 |
| 2012 | 15 | 12 |
| 2013 | 5 | 11 |
| 2014 | 10 | 17 |
| 2015 | 8 | 26 |
| 2016 | 12 | 21 |
| 2017 | 14 | 26 |
| 2018 | 25 | 27 |
| 2019 | 23 | 48 |
| 2020 | 27 | 37 |
| 2021 | 35 | 45 |
| 2022 | 26 | 21 |
| 2023 | 19 | 26 |
| 2024 | 23 | 14 |
| 2025 | 17 | 20 |
| 2026 | 11 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Electrical component and method of forming same4 Aug 2026US 12,701,657 B2Medtronic, Inc.
- Circuit board with embedded elements and method for fabricating the same26 May 2026US 12,641,730 B2Boardtek Electronics Corporation
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Base material for printed circuit, printed circuit, and method of manufacturing base material for printed circuit28 Apr 2026US 12,611,845 B2Sumitomo Electric Industries, Ltd.
- Method for forming conductive structure27 Aug 2026US 2026/0255495 A1Dupont Electronics, Inc.
- Method for manufacturing conductive film and conductive film20 Aug 2026US 2026/0241712 A1Ricoh Company, Ltd.
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248009 A1Heraeus Electronics GmbH & Co. KG
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Method for producing electronic component and method for producing mount structure6 Aug 2026US 2026/0229412 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Methods for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging128US 6,348,295 B1Massachusetts Institute of Technology · 2002
- Process for producing a multi-layer wiring board86US 6,143,116 AKYOCERA Corporation · 2000
- Method of manufacturing multilayer circuit substrate73US 5,746,868 AFujitsu Limited · 1998
- Method for manufacturing conductors and semiconductors65US 9,011,762 B2Valtion Teknillinen Tutkimuskeskus · 2015
- Apparatus and method of dispensing small-scale powders59US 7,316,748 B2Wisconsin Alumni Research Foundation · 2008