Method for manufacturing conductors and semiconductors
AssigneeValtion Teknillinen Tutkimuskeskus
InventorsHeikki Seppä, Mark Allen
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Abstract
The invention relates to a sintering method for manufacturing structures by sintering. In addition, the invention relates to a sintered product, an electronic module, and new uses. In the method, a particle material containing conductive or semiconductive encapsulated nanoparticles is sintered, in order to increase its electrical conductivity, by applying a voltage over the particle material. In the method, a substrate is typically used, one surface of which is at least partly equipped with a layer containing nanoparticles. The method is based on thermal feedback between the voltage feed and the nanoparticles. The invention permits the manufacture of conductive and semiconductive structures and pieces by sintering at room temperature and at normal pressure.
Claims38
Sintering method, in which:
- a particle material, containing conductive or semiconductive nanoparticles encapsulated by an encapsulation material, is sintered to join a plurality of said conductive or semiconductive nanoparticles-to each other, thereby increasing the electrical conductivity of said particle material, the method comprising:
- arranging said encapsulated conductive or semiconductive nanoparticles in said particle material as a layer on an insulating substrate;
- applying a voltage over the particle material containing said encapsulated conductive or semiconductive nanoparticles, such that said voltage creates an electric field that initiates a melting of said encapsulation material;
- melting said encapsulation material between said conductive or semiconductive nanoparticles using said voltage, wherein said conductive or semiconductive nanoparticles come in contact with each other when their encapsulation material is melted;
- and
- sintering together said conductive or semiconductive nanoparticles that are in contact with each other, using a positive thermal feedback and micro-level heating caused by said voltage, thereby forming a conductive material that has an electrical conductivity that is higher than the electrical conductivity of said particle material.
Sintering method, in which:
- a particle material, containing conductive or semiconductive encapsulated nanoparticles is sintered to join a plurality of said conductive or semiconductive nanoparticles onto each other, thereby increasing the electrical conductivity of said particle material,
- wherein said encapsulated nanoparticles in said particle material are arranged as a layer on an insulating substrate, and
- wherein
- the sintering is performed by applying a voltage over the layer of the particle material containing said encapsulated nanoparticles, such that the encapsulation of said nanoparticles is melted and said nanoparticles come in contact with each other and are sintered, thereby forming a portion in the layer of particle material having an electrical conductivity that is higher than the electrical conductivity of said layer of particle material, and
- after removal of said voltage, said portion remains on said insulating substrate.
Dependencies are inferred from the claim text.