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US 12,611,845 B2Granted
Base material for printed circuit, printed circuit, and method of manufacturing base material for printed circuit
AssigneeSumitomo Electric Industries, Ltd.
InventorsTakuto Hidani, Kousuke Miura
Life of this patent
Estimating the term…
Abstract
A base material for a printed circuit of the present disclosure includes a base film containing polyimide as a main component, and a conductor layer formed on at least one surface of the base film. The conductor layer includes a metal sintered layer formed on the base film and an electroless plating layer formed on the metal sintered layer, and in the base film, a number of voids having a maximum width of 5 μm or more in plan view is 10 or less per a reference unit area of 0.25 mm2 on a surface of the base film.
Claims3
A base material for a printed circuit, the base material comprising:
- a base film containing polyimide as a main component, wherein the base film contains palladium in an amount of from 0.05 ppm to 10 ppm;
- and
- a conductor layer formed on at least one surface of the base film,
- wherein the conductor layer includes a metal sintered layer formed on the base film and an electroless plating layer formed on the metal sintered layer,
- wherein, on an exposed surface of the base film obtained by removing the conductor layer for evaluation, a number of voids having a maximum width of 5 μm or more in plan view and a height of 1.5 μm or more is 10 or less per a reference unit area of 0.25 mm2 on the exposed surface of the base film, the number being determined from a metallurgical microscope plan view image by image processing to extract void regions and determining per the reference unit area of 0.25 mm2, and the height being measured by laser microscopy, and
- wherein the base material exhibits a carbon dioxide generation amount of 1 μg/cm2 or less when held at 350° C. for 90 minutes under thermogravimetry-mass spectrometry (TG-MS) measurement.
3 more elements
Dependencies are inferred from the claim text.