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US 2026/0229412 A1Published application
Method for producing electronic component and method for producing mount structure
AssigneeMurata Manufacturing Co., Ltd.
InventorYasuhiro NISHISAKA
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Abstract
An electronic component includes a body, an inner electrode within the body, and an outer electrode outside of the body, wherein the outer electrode includes an outermost layer that includes metal particles but is not electrically connected to the inner electrode.
Claims6
A method for producing an electronic component, the method comprising:
- preparing a body within which an inner electrode is disposed;
- and
- forming an outer electrode outside of the body;
- wherein
- in the forming the outer electrode, an outermost-layer-forming conductive paste including metal particles and a solvent is applied to a surface, and subsequently, the outermost-layer-forming conductive paste is dried at a temperature at which the solvent evaporates but sintering of the metal particles does not begin, to form a dry film as an outermost layer of the outer electrode.
2 more elements
Dependencies are inferred from the claim text.