Method of manufacturing multilayer circuit substrate
AssigneeFujitsu Limited
InventorTomoyuki Abe
Life of this patent
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Abstract
A method of manufacturing a multilayer circuit substrate includes a process of forming via holes in an insulating film, a process of applying an electrically conducting paste obtained by having ultra-fine metal particles disperse in a solvent onto an insulating film, and a process of forming vias composed of a sintered product of ultra-fine metal particles in the via holes by removing the solvent and also sintering the ultra-fine metal particles. The sintered products of the ultra-fine metal particles on the insulating layer is removed (or patterned) by peeling off the protective film stuck to the insulating layer.
Claims18
A method of manufacturing a multilayer circuit substrate, comprising the steps of:
- forming via holes in an insulating film on an under layer;
- applying an electrically conductive paste obtained by having ultra-fine metal particles dispersed in a solvent onto said insulating film and into said via holes, said ultra-fine metal particles having a grain size of 5 to 50 nm;
- and
- forming vias composed of a sintered product of said ultra-fine metal particles in said via holes by removing said solvent and also sintering said ultra-fine metal particles by heating at a temperature of approximately 300.degree. C.
A method of manufacturing a multilayer circuit substrate, comprising the steps of:
- sticking a protective film on an insulating film;
- forming an opening in said protective film;
- forming a via hole in said insulating film under said opening;
- applying an electrically conductive paste having ultra-fine metal particles dispersed in a solvent onto said protective film and into said opening and via-hole;
- heating said electrically conductive paste to remove said solvent and to make said ultra-fine metal particles into sintered product;
- and
- peeling off said protective film from said insulating film to remove said sintered product over said insulating film so that said sintered product remains in said via-hole as a via.
Dependencies are inferred from the claim text.