H05K 2203/1152
Replicating the surface structure of a sacrificial layer
Official title: Replicating the surface structure of a sacrificial layer, e.g. for roughening
H05K2203/1152 (Replicating the surface structure of a sacrificial layer) appears on 135 US grants and 152 published applications in this corpus.
Search patents in H05K- Granted patents
- 135
- Published applications
- 152
- Assignees
- 75
- Inventors
- 347
- Latest grant
- 2 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 10 |
| 2002 | 6 | 4 |
| 2003 | 4 | 6 |
| 2004 | 6 | 10 |
| 2005 | 6 | 4 |
| 2006 | 4 | 8 |
| 2007 | 5 | 18 |
| 2008 | 3 | 17 |
| 2009 | 5 | 18 |
| 2010 | 10 | 7 |
| 2011 | 14 | 10 |
| 2012 | 10 | 10 |
| 2013 | 8 | 3 |
| 2014 | 3 | 3 |
| 2015 | 1 | 2 |
| 2016 | 3 | 3 |
| 2017 | 2 | 1 |
| 2018 | 2 | 2 |
| 2019 | 2 | 2 |
| 2020 | 3 | 2 |
| 2021 | 0 | 4 |
| 2022 | 1 | 3 |
| 2023 | 0 | 1 |
| 2024 | 2 | 2 |
| 2025 | 2 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
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- Stacking structure applicable to manufacturing circuit board3 May 2022US 11,322,377 B2Unimicron Technology Corp.
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- Metal foil with carrier10 Jul 2025US 2025/0227855 A1Mitsui Mining & Smelting Co., Ltd.
- Circuit board and antenna device comprising same1 Aug 2024US 2024/0260175 A1LG Innotek Co., Ltd.
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- Method for manufacturing circuit board and stacked structure16 Nov 2023US 2023/0371189 A1Unimicron Technology Corp.
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Process for manufacturing a printed wiring board107US 6,775,907 B1International Business Machines Corporation · 2004
- Flexible film semiconductor chip carrier93US 4,681,654 AInternational Business Machines Corporation · 1987
- Method of fabricating printed circuit board having embedded multi-layer passive devices86US 7,293,356 B2Samsung Electro-Mechanics Co., Ltd. · 2007
- Full additive process with filled plated through holes55US 6,664,485 B2International Business Machines Corporation · 2003