Stacking structure applicable to manufacturing circuit board
AssigneeUnimicron Technology Corp.
InventorPo-Hsuan Liao
Life of this patent
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Abstract
A stacking structure is applicable to manufacturing a circuit board. The stacking structure includes a transferring layer and a dielectric layer disposed on the transferring layer. The transferring layer includes a substrate and a thin film disposed on the substrate and having a plurality of recess structures thereon. The recess structures are connected as a single piece and bottom portions and top portions of the recess structures are configured to arrange in a staggered manner to form a multi-dimensional arrangement. At least a portion of the dielectric layer being is located in the recess structures, such that the dielectric layer is at least embedded with the recess structures.
Claims9
A stacking structure applicable to manufacturing a circuit board, the stacking structure comprising:
- a transferring layer, comprising:
- a substrate;
- and
- a thin film continuously extending over the substrate and having a plurality of recess structures thereon, wherein the recess structures are connected as a single piece, bottom portions and top portions of the recess structures are configured to arrange in a staggered manner to form a multi-dimensional arrangement;
- and
- a dielectric layer disposed on the transferring layer, wherein at least a portion of the dielectric layer is located in the recess structures, such that the dielectric layer is at least embedded with the recess structures.
Dependencies are inferred from the claim text.