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US 2024/0098884 A1Published application
Circuit board and method for manufacturing same
AssigneeLG Innotek Co., Ltd.
InventorsDo Hyuk YOO, Seul Gi LEE, Du Hyun KIM
Life of this patent
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Abstract
A circuit board according to an embodiment includes an insulating layer; and a via formed in the insulating layer; wherein a width of an upper surface of the via is greater than a width of a lower surface of the via, and wherein the width of the lower surface of the via is 75% to 95% of the width of the upper surface of the via.
Claims16
-10. (canceled)
A circuit board comprising:
- an insulating layer including an upper surface to which a surface roughness (Ra) is imparted,
- wherein the surface roughness (Ra) of the upper surface of the insulating layer satisfies a range of 110 nm to 190 nm, and
- wherein a difference between a maximum value and a minimum value of the surface roughness (Ra) imparted to the upper surface of the insulating layer is 50 nm or less.
A method for manufacturing a circuit board, the method comprising:
- preparing an insulating layer in a semi cured state;
- imparting a surface roughness (Ra) to an upper surface of the insulating layer by laminating a metal layer on the upper surface of the insulating layer;
- removing the metal layer;
- fully curing the insulating layer after the metal layer is removed;
- forming a via hole passing through upper and lower surfaces of the insulating layer;
- desmearing the upper surface of the insulating layer and an inner wall of the via hole;
- and
- forming a via electrode filling the via hole,
- wherein a surface roughness (Ra) of the upper surface of the insulating layer after the desmearing satisfies a range of 110 nm to 190 nm, and
- wherein a difference between a maximum value and a minimum value of the surface roughness (Ra) imparted to the upper surface of the insulating layer after the desmearing is 50 nm or less.
7 more elements
Dependencies are inferred from the claim text.