Method for manufacturing circuit board

A method for manufacturing a circuit board, comprising:

• providing a composite material film, wherein the composite material film comprises a metal film and a polymeric film;
• disposing a dielectric layer on the polymeric film to form a stacked structure;
• forming a first circuit layer on a substrate, wherein the first circuit layer comprises at least one contact pad;
• bonding the stacked structure onto the substrate and the first circuit layer, such that the dielectric layer directly contacts the substrate and entirely covers the first circuit layer;
• forming a first opening extending through and in the metal film to form a patterned metal film;
• plasma etching the dielectric layer with the patterned metal film as a mask to form a second opening in the dielectric layer, wherein the at least one contact pad is exposed in the second opening;
• removing the composite material film;
• and
• depositing a conductive material in the second opening to form a conductive blind hole electrically connected to the at least one contact pad.