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US 12,408,262 B2Granted
Circuit board and method for manufacturing same
AssigneeLG Innotek Co., Ltd.
InventorsDo Hyuk Yoo, Seul Gi Lee, Du Hyun Kim
Life of this patent
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Abstract
A circuit board according to an embodiment includes an insulating layer; and a via formed in the insulating layer; wherein a width of an upper surface of the via is greater than a width of a lower surface of the via, and wherein the width of the lower surface of the via is 75% to 95% of the width of the upper surface of the via.
Claims7
A circuit board comprising:
- an insulating layer including an upper surface to which a surface roughness (Ra) is imparted;
- and
- a via electrode disposed in a via hole of the insulating layer,
- wherein the surface roughness (Ra) of the upper surface of the insulating layer satisfies a range of 110 nm to 190 nm,
- wherein a difference between a maximum value and a minimum value of the surface roughness (Ra) imparted to the upper surface of the insulating layer is 40 nm or less,
- wherein the surface roughness (Ra) of the upper surface of the insulating layer satisfies a range of 130 nm to 170 nm,
- wherein a surface roughness (Ra) of a side surface of the via electrode satisfies a range of 120 nm to 200 nm,
- wherein the maximum value is a maximum value of surface roughness (Ra) within a 1 mm*1 mm region of the upper surface of the insulating layer, and
- wherein the minimum value is a minimum value of surface roughness (Ra) within the 1 mm*1 mm region.
6 more elements
Dependencies are inferred from the claim text.