Laser folded 3D electronics
AssigneeThe United States of America as represented by the Secretary of the Army
InventorsNathan S. Lazarus, Adam L. Bachmann, Michael D. Dickey
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Abstract
A novel methodology of forming a three-dimensional electronic device according to various embodiments of the present invention is described. The methodology comprises, at least, a step of laser folding, using only a laser, a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer, with the laser impinging upon the at least one metal layer to make one or more folds of the printed circuit board to form a three-dimensional electronic device structure.
Claims21
A method of forming a three-dimensional electronic device comprising:
- laser folding, using only a laser, a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer, the laser impinging upon the at least one metal layer to make one or more folds of the printed circuit board to form a three-dimensional electronic device structure.
A method of laser forming a three-dimensional electronic device comprising:
- providing a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer;
- reducing the reflectivity of the surface of the at least one metal layer to the laser light for laser folding;
- and
- laser folding, using only a laser, the two-dimensional printed circuit board at least partially covered with the at least one metal layer, the laser impinging upon the at least one metal layer to make one or more folds of the printed circuit board to form a three-dimensional electronic device structure.
An apparatus for forming a three-dimensional electronic device comprising:
- a clamp fixture to secure a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer;
- and
- at least one laser configured to:
- (i) reduce the reflectivity of the surface of the at least one metal layer to reduce the reflectivity of the laser light for laser folding;
- (ii) laser cut fold a two-dimensional printed circuit board at least partially covered with the at least one metal layer;
- and
- (iii) laser fold the two-dimensional printed circuit board at least partially covered with the at least one metal layer, the laser impinging upon the at least one metal layer to form a three-dimensional electronic device structure.
Dependencies are inferred from the claim text.