H05K 2203/1147
Sealing or impregnating
Official title: Sealing or impregnating, e.g. of pores
H05K2203/1147 (Sealing or impregnating) appears on 224 US grants and 200 published applications in this corpus.
Search patents in H05K- Granted patents
- 224
- Published applications
- 200
- Assignees
- 173
- Inventors
- 589
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 0 |
| 2002 | 6 | 9 |
| 2003 | 3 | 4 |
| 2004 | 3 | 11 |
| 2005 | 6 | 10 |
| 2006 | 8 | 6 |
| 2007 | 4 | 5 |
| 2008 | 5 | 14 |
| 2009 | 8 | 19 |
| 2010 | 8 | 19 |
| 2011 | 9 | 10 |
| 2012 | 10 | 7 |
| 2013 | 14 | 7 |
| 2014 | 4 | 9 |
| 2015 | 7 | 8 |
| 2016 | 8 | 9 |
| 2017 | 7 | 8 |
| 2018 | 9 | 1 |
| 2019 | 6 | 6 |
| 2020 | 3 | 7 |
| 2021 | 7 | 6 |
| 2022 | 6 | 7 |
| 2023 | 3 | 4 |
| 2024 | 4 | 5 |
| 2025 | 4 | 5 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device including thermal interface material21 Apr 2026US 12,610,449 B2Samsung Electronics Co., Ltd.
- Corrosion preventive heatsink for network device3 Feb 2026US 12,543,291 B2Cisco Technology, Inc.
- Electronic device comprising sealing member20 Jan 2026US 12,532,410 B2Samsung Electronics Co., Ltd.
- Module and method for manufacturing same30 Sep 2025US 12,432,858 B2Murata Manufacturing Co., Ltd.
- Method for shielding a printed circuit board from electromagnetic interference and noise during testing29 Apr 2025US 12,289,822 B2Skyworks Solutions, Inc.
- Circuit board and manufacturing method thereof14 May 2026US 2026/0136470 A1Daeduck Electronics Co., Ltd.
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
- Semiconductor core layer including glass sheet having edge sealant structure and method of making same26 Mar 2026US 2026/0090425 A1Intel Corporation
- Junction block for distributing high-current power12 Mar 2026US 2026/0075722 A1Kyungshin Corp.
- Shielding a printed circuit board from electromagnetic interference and noise during testing13 Nov 2025US 2025/0351261 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Microelectronic devices and methods for forming interconnects in microelectronic devices70US 7,232,754 B2Micron Technology, Inc. · 2007
- Method and apparatus for improving wireability in chip modules67US 5,879,787 AW. L. Gore & Associates, Inc. · 1999
- Matched low dielectric constant, dimensionally stable adhesive sheet62US 5,652,055 AW. L. Gore & Associates, Inc. · 1997
- Integrated electromagnetic interference filters and feedthroughs57US 7,719,854 B2Cardiac Pacemakers, Inc. · 2010