Microelectronic devices and methods for forming interconnects in microelectronic devices

A method of forming an interconnect in a microelectronic die, the method comprising:

• providing a microelectronic substrate having a front side, a backside, and a microelectronic die including an integrated circuit and a terminal at the front side of the substrate operatively coupled to the integrated circuit;
• forming a passage extending completely through the substrate and the terminal, the passage having an opening at the terminal;
• forming a conductive cap that occludes the opening and is in electrical contact with the terminal;
• and
• constructing an interconnect in at least a portion of the passage and contacting the conductive cap.

A method of forming an interconnect in a microelectronic die, the die including a substrate having a front side and a backside, an integrated circuit, and a terminal at the front side of the substrate operatively coupled to the integrated circuit, the method comprising:

• forming a passage extending at least partially through the substrate and the terminal, the passage having an opening at the terminal;
• occluding the opening with a conductive cap that is in electrical contact with the terminal;
• and
• depositing a conductive fill material into the passage and in contact with the conductive cap.

A method of manufacturing a microfeature workpiece having a plurality of microelectronic dies, the individual dies including an integrated circuit and a plurality of terminals operatively coupled to the integrated circuit, the method comprising:

• forming a plurality of passages extending completely through each die and each terminal;
• forming a conductive cap in corresponding passages proximate to a front side of the workpiece and in electrical contact with corresponding terminals;
• and
• depositing a conductive material into the passages and in contact with the conductive caps.