Corrosion preventive heatsink for network device
AssigneeCisco Technology, Inc.
InventorsMehmet Onder Cap, Manigandan Boopalan, Joel Richard Goergen, Sandeep Mehdiratta, Manjunatha Reddy Shivashankara, Damaruganath Pinjala
Life of this patent
Estimating the term…
Abstract
In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
Claims20
An apparatus comprising:
- a chassis comprising a plurality of upward extending walls;
- a printed circuit board mounted on the chassis;
- a heatsink positioned over the printed circuit board to prevent corrosion of the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, and the plurality of downward extending walls are positioned interior of the plurality of upward extending walls of the chassis;
- power components mounted on the chassis adjacent to the heatsink;
- and
- a seal interposed between an edge of the plurality of downward extending walls and the chassis, wherein the seal is positioned between the chassis and the printed circuit board.
An apparatus comprising:
- a chassis;
- a printed circuit board mounted on the chassis;
- a heatsink positioned over the printed circuit board, wherein the heatsink comprises a plurality of fins and a plurality of walls, wherein the heatsink at least partially defines a first cavity extending between the printed circuit board and the heatsink and a second cavity extending between the printed circuit board and the chassis, and each of the plurality of walls of the heatsink is exposed to the first cavity and the second cavity;
- and
- a seal positioned between the chassis and the printed circuit board, wherein the seal extends at least partially into the second cavity, and each of the plurality of walls of the heatsink extends past the printed circuit board and engages with the seal.
An apparatus comprising:
- a chassis;
- a printed circuit board mounted on the chassis;
- a seal positioned on the chassis;
- and
- a heatsink positioned over the printed circuit board, wherein the heatsink comprises a plurality of fins and a plurality of walls, each of the plurality of walls comprises a first edge and a second edge, the first edge being engaged with a side of the printed circuit board facing away from the chassis, each of the plurality of walls extends past the printed circuit board such that the second edge is engaged with the seal, and each of the plurality of walls of the heatsink is exposed to a cavity extending between the printed circuit board and the chassis.
Dependencies are inferred from the claim text.