Module and method for manufacturing same
AssigneeMurata Manufacturing Co., Ltd.
InventorsMinoru Hatase, Yoshihito Otsubo
Life of this patent
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Abstract
A module includes a substrate having a first surface and at least one recess on the first surface, and an electronic component mounted on the first surface. The electronic component is connected to the substrate via a plurality of bumps. All of the plurality of bumps are connected to the first surface inside any of the at least one recess. A height of the plurality of bumps is greater than a depth of the at least one recess. When viewed in a direction perpendicular to the first surface, a part of the electronic component is located outside an outer periphery of any recess selected from the at least one recess.
Claims5
A module comprising:
- a substrate having a first surface and at least one recess on the first surface;
- and
- an electronic component mounted on the first surface, wherein
- the electronic component is connected to the substrate via a plurality of bumps,
- all of the plurality of bumps are connected to the first surface inside any of the at least one recess,
- a height of each of the plurality of bumps is greater than a depth of the at least one recess,
- a part of the electronic component is located outside an outer periphery of any recess selected from the at least one recess when viewed in a direction perpendicular to the first surface, and
- two or more bumps selected from the plurality of bumps are connected to the first surface in one recess selected from the at least one recess.
Dependencies are inferred from the claim text.