Electronic device including thermal interface material

An electronic device comprising:

• a printed circuit board including a first surface, a second surface opposite to the first surface, and a first through hole passing through the first surface and the second surface;
• a first electronic component disposed on the first surface;
• a first shield can disposed on a partial area of the first surface including the first through hole, and covering the first electronic component;
• and
• a thermal interface material injected through the first through hole, and included in a space (S1) between the first surface and the first shield can,
• wherein the first shield can includes:
• a first part substantially parallel to the first surface, and
• a second part extending from a periphery of the first part to the first surface and coupled to the first surface,
• wherein the thermal interface material at least partially occupies a space between the first part and a surface of the first electronic component facing the first part, and is at least partially in contact with the first electronic component, and
• wherein the space between the first surface and the first shield can is connected to an external space of the first shield can through at least one opening part formed in at least one of the first shield can or the printed circuit board.