H05K 2203/1121
Cooling
Official title: Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
H05K2203/1121 (Cooling) appears on 115 US grants and 103 published applications in this corpus.
Search patents in H05K- Granted patents
- 115
- Published applications
- 103
- Assignees
- 86
- Inventors
- 347
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 4 |
| 2003 | 4 | 5 |
| 2004 | 3 | 11 |
| 2005 | 6 | 8 |
| 2006 | 4 | 5 |
| 2007 | 5 | 3 |
| 2008 | 1 | 4 |
| 2009 | 3 | 4 |
| 2010 | 1 | 5 |
| 2011 | 5 | 3 |
| 2012 | 3 | 5 |
| 2013 | 3 | 3 |
| 2014 | 1 | 2 |
| 2015 | 3 | 7 |
| 2016 | 5 | 2 |
| 2017 | 3 | 4 |
| 2018 | 1 | 2 |
| 2019 | 0 | 1 |
| 2020 | 2 | 4 |
| 2021 | 4 | 7 |
| 2022 | 1 | 3 |
| 2023 | 4 | 1 |
| 2024 | 4 | 4 |
| 2025 | 0 | 2 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board7 Jul 2026US 12,677,381 B2Avary Holding (Shenzhen) Co., Limited.
- Flattening a circuit board assembly using vacuum pressure27 Jan 2026US 12,538,434 B2Teradyne, Inc.
- System and method for creating orthogonal solder interconnects1 Oct 2024US 12,108,542 B2Raytheon Company
- Layered device for pressure treatment and method10 Sep 2024US 12,089,344 B2Canatu Oy
- Methods of manufacturing circuit board and circuit board assembly13 Aug 2024US 12,063,752 B2Avary Holding (Shenzhen) Co., Limited.
- Electrically connecting a flexible circuit to a support structure27 Aug 2026US 2026/0255501 A1Teradyne, Inc.
- Hot air liquid conductive cooling (halcc) device16 Jul 2026US 2026/0206146 A1Flex Ltd.
- Reflow soldering oven22 Jan 2026US 2026/0025932 A1Illinois Tool Works Inc.
- Power supply device and a method of manufacturing thereof16 Oct 2025US 2025/0324511 A1Kabushiki Kaisha Toyota Jidoshokki
- Systems, methods, storage medium for inkjet-printed gel-electronic7 Aug 2025US 2025/0254793 A1The Regents of the University of Colorado, a body corporate
Most cited
By later US patents
- Double-sided touch sensitive panel and flex circuit bonding59US 7,999,795 B2Apple Inc. · 2011
- Method of producing an overmolded electronic module with a flexible circuit pigtail49US 7,739,791 B2Delphi Technologies, Inc. · 2010
- Method of soldering in a controlled-convection surface-mount reflow furnace47US 5,232,145 AWatkins-Johnson Company · 1993
- Method of using frozen epoxy for placing pin-mounted components in a circuit module43US 5,255,431 AGeneral Electric Company · 1993
- Continuous process for the manufacture of printed circuit boards39US 4,659,425 AIBM Corporation · 1987