Reflow soldering oven

Abstract

A reflow soldering oven for soldering an electronic circuit board, the reflow soldering oven comprising: a first temperature control chamber for applying a first temperature profile to the electronic circuit board; a second temperature control chamber for applying a second temperature profile to the electronic circuit board; a vacuum system comprising a vacuum pump and a vacuum chamber for removing voids in a solder on the electronic circuit board, wherein the vacuum chamber is positioned intermediate the first temperature control chamber and the second temperature control chamber and is fluidly connected to the vacuum pump; and a gas purification system for purifying gas that contains flux components vaporized from the electronic circuit board.

Dependencies are inferred from the claim text.