Methods of manufacturing circuit board and circuit board assembly

A method for manufacturing a circuit board, comprising the steps:

• providing a first circuit substrate, the first circuit substrate comprising a first base layer, a first circuit layer, a third circuit layer, and a plurality of first conductive bodies arranged in the first base layer, the first conductive bodies formed by an electroplating process;
• wherein:
• the first circuit layer and the third circuit layer are arranged opposite sides of the first base layer, the first circuit layer comprises an etching line, the etching line dividing the first circuit layer into a hot pressing area located inside the etching line and a non-hot pressing area located outside the etching line;
• the hot pressing area comprising the plurality of first conductive bodies, the first conductive body comprising a first end and a second end opposite the first end, the first end electrically connected to the hot pressing area, the third circuit layer includes a signal circuit and a plurality of first ground pads electrically isolated from the signal circuit;
• a side of the first ground pads adjacent to the first circuit layer is electrically connected to the first circuit layer through the plurality of first conductive bodies;
• providing a second circuit substrate, the second circuit substrate comprising a second base layer, a second circuit layer, and a plurality of second conductive bodies, the second conductive bodies comprising a conductive paste;
• wherein:
• the second conductive body comprises a third end and a fourth end opposite the third end, the third end electrically connected to the second circuit layer;
• stacking the first circuit substrate and the second circuit substrate such that the second end corresponds to the fourth end in position to obtain an intermediate body;
• and
• pressing and bonding the intermediate body so that the second end and the fourth end are electrically connected to obtain the circuit board, wherein a side of the first ground pads away from the first circuit layer is electrically connected to the second circuit layer through the second conductive bodies;
• the electrically connected first circuit layer, first conductive bodies, first ground pads, second conductive bodies, and second circuit layer form a shielding shell;
• and the signal circuit is located in the shielding shell.