System and method for creating orthogonal solder interconnects

An apparatus for soldering an electrical component to a circuit board, the apparatus comprising:

• a stage configured to position the circuit board and the electrical component in alignment with a soldering tip along an axis;
• a first spring-loaded compression mechanism configured to apply a first force to the circuit board and the electrical component to maintain contact between the circuit board and the electrical component when the first spring-loaded compression mechanism is forced toward the circuit board and the electrical component along the axis;
• and
• a second spring-loaded compression mechanism configured to apply a second force along the axis to the soldering tip to bring the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts;
• wherein the first spring-loaded compression mechanism is configured to maintain the contact between the circuit board and the electrical component while the solder cools and solidifies when the second spring-loaded compression mechanism removes the second force such that the soldering tip comes out of thermal contact with the circuit board and the electrical component;
• wherein the first spring-loaded compression mechanism and the second spring-loaded compression mechanism are vertically aligned relative to each other;
• and
• wherein the first spring-loaded compression mechanism and the second spring-loaded compression mechanism respectively comprise first and second vertically-adjustable force adjusting collars configured to independently control the first and second forces, respectively.