Flattening a circuit board assembly using vacuum pressure
AssigneeTeradyne, Inc.
InventorEric Boiselle
Life of this patent
Estimating the term…
Abstract
An example method of flattening a circuit board assembly includes attaching the circuit board assembly to a structure having dimensions that partly enclose a space, where attachment of the circuit board assembly to the structure creates an air-tight seal over the space, and where the structure has at least one port in fluid communication with the space. The method also includes applying vacuum pressure to the space via the at least one port, where the vacuum pressure forces at least part of the circuit board assembly toward the space, and dispensing thermal interface material selectively onto parts of the circuit board assembly while the vacuum pressure is applied.
Claims23
A system comprising:
- a structure having a bottom surface and sidewalls that enclose a space such that attachment of a circuit board assembly to a top of the structure creates an air-tight seal over the space, the structure having at least one port configured to allow air to pass from the space,
- wherein the structure comprises one or more ribs within the space enclosed by the sidewalls and the bottom surface, where locations of the one or more ribs within the space correspond to locations of the circuit board assembly that do not include components, and where the one or more ribs comprise walls that have a height that reaches a height of the sidewalls of the structure;
- a vacuum source to apply vacuum pressure to the space via the at least one port, the vacuum pressure being of sufficient magnitude and duration to force at least part of the circuit board assembly toward the space;
- and
- a robot to dispense thermal interface material selectively onto parts of the circuit board assembly while the vacuum pressure is applied.
Dependencies are inferred from the claim text.