Layered device for pressure treatment and method
AssigneeCanatu Oy
InventorIlkka Varjos
Life of this patent
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Abstract
A layered device having two base films, a conductive pattern attached to the first base film facing the second base film and a bonding layer binding the first base film and the second base film together. The bonding layer includes an opening, and the conductive pattern having an exposed portion aligned with the opening in the bonding layer. Further disclosed is a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least part of the space created by the opening in the bonding layer. Also disclosed is a method of producing a layered device.
Claims24
A layered device, comprising
- a first base film,
- a second base film positioned parallel to the first base film at a predetermined distance,
- a conductive pattern attached to a surface of the first base film facing the second base film,
- a bonding layer filling at least partially the space between the first base film and the second base film, enclosing a portion of the conductive pattern and binding the first base film and the second base film together,
- wherein
- the bonding layer comprises an opening,
- the conductive pattern comprises at least one exposed portion aligned with the opening in the bonding layer, wherein at least an end portion of the exposed portion of the conductive pattern is loose and detached from the first base film, and
- the device further comprises a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least part of the space created by the opening in the bonding layer.
A layered device, comprising
- a first base film,
- a second base film positioned parallel to the first base film at a predetermined distance,
- a conductive pattern attached to a surface of the first base film facing the second base film,
- a bonding layer filling at least partially the space between the first base film and the second base film, enclosing a portion of the conductive pattern and binding the first base film and the second base film together,
- wherein
- the bonding layer comprises an opening,
- the conductive pattern comprises at least one exposed portion aligned with the opening in the bonding layer, wherein at least an end portion of the exposed portion of the conductive pattern is loose and detached from the first base film, and
- the device further comprises a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least part of the space created by the opening in the bonding layer;
- wherein the spacer comprises a peel-off coating that evenly fills at least part of the space created by the opening in the bonding layer.
A method for producing a layered electronic device, comprising
- providing a first base film and a second base film positioned parallel to the first base film at a predetermined distance,
- applying a conductive pattern to a surface of the first base film facing the second base film,
- printing a spacer on the first base film and a portion of the conductive pattern,
- preparing a bonding layer by cutting it to a predetermined shape comprising an opening,
- placing the bonding layer between the first base film and the second base film to fill at least partially the space between the first base film and the second base film, and enclosing a portion of the conductive pattern, such that the opening in the bonding layer is aligned with the location of the spacer printed on the first base film and the portion of the conductive pattern, and pressure-treating the resulting layered structure at a predetermined temperature.
Dependencies are inferred from the claim text.