Hot air liquid conductive cooling (halcc) device

A method for reworking or removing circuit components provided on both sides of a printed circuit board assembly (PCBA), comprising:

• providing a printed circuit board assembly (PCBA) with circuit components provided on a first side and a second side, opposite the first side of the PCBA;
• immersing the circuit components provided on the second side of the PCBA into a tank containing a liquid medium at a predetermined temperature;
• and
• providing a nozzle connectable with a heat source over at least one of the circuit components provided on the first side of the PCBA for rework or removal while maintaining the predetermined temperature of the liquid medium.

A reflow method, comprising:

• loading a reflow profile of a printed circuit board assembly (PCBA) into a reflow system;
• installing the PCBA provided within a rework device into a reflow chamber machine of the reflow system,
• wherein the reflow device includes:
• a tank containing a liquid medium at a predetermined temperature;
• a top cover having a first side and a second side opposite to the first side,
• wherein the second side of the top cover is in contact with a top surface of the tank, and
• wherein the PCBA has a first side and a second side opposite the first side and attached to the top cover;
• and
• a plurality of circuit components,
• wherein at least one of the plurality of circuit components is provided on the first side of the PCBA and at least another of the plurality of circuit components is provided on the second side of the PCBA, below the second side of the top cover and submerged in the liquid medium;
• providing a nozzle connectable with a heat source over the at least one of the plurality of circuit components provided on the first side of the PCBA for rework or removal while maintaining the predetermined temperature of the liquid medium;
• performing rework on the at least one of the plurality of circuit components provided on the first side of the PCBA;
• and
• updating the reflow profile based on a result of the rework performed on the at least one of the plurality of circuit components provided on the first side of the PCBA.