H05K 2203/1115
Resistance heating
Official title: Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
H05K2203/1115 (Resistance heating) appears on 139 US grants and 89 published applications in this corpus.
Search patents in H05K- Granted patents
- 139
- Published applications
- 89
- Assignees
- 96
- Inventors
- 309
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 0 |
| 2002 | 7 | 4 |
| 2003 | 4 | 1 |
| 2004 | 4 | 1 |
| 2005 | 0 | 2 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 2 | 4 |
| 2009 | 0 | 3 |
| 2010 | 1 | 7 |
| 2011 | 2 | 3 |
| 2012 | 0 | 5 |
| 2013 | 5 | 5 |
| 2014 | 0 | 5 |
| 2015 | 5 | 5 |
| 2016 | 6 | 6 |
| 2017 | 5 | 3 |
| 2018 | 4 | 3 |
| 2019 | 3 | 4 |
| 2020 | 1 | 6 |
| 2021 | 4 | 2 |
| 2022 | 2 | 6 |
| 2023 | 3 | 2 |
| 2024 | 5 | 4 |
| 2025 | 2 | 2 |
| 2026 | 3 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Donor plate, deposition device and deposition method19 May 2026US 12,635,079 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Shaping method and shaping device7 Apr 2026US 12,594,716 B2Fuji Corporation
- Circuit board cooling configurations28 Oct 2025US 12,457,680 B2Microsoft Technology Licensing, LLC
- PTC heater with reduced switch-on current23 Sep 2025US 12,424,357 B2TDK Electronics Co., Ltd.
- Method and device for depositing components on a substrate9 Jul 2026US 2026/0198152 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Printed circuit board assembly, heating control circuit and control method thereof28 May 2026US 2026/0150181 A1Getac Technology Corporation
- Cold-bar soldering systems and methods14 May 2026US 2026/0136453 A1Lutron Technology Company LLC
- Thermal processing device and method9 Apr 2026US 2026/0101417 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Circuit Board Cooling Configurations29 Jan 2026US 2026/0032804 A1Microsoft Technology Licensing, LLC
Most cited
By later US patents
- Thermally assisted shorts removal process for glass ceramic product using an RF field149US 5,290,986 AInternational Business Machines Corporation · 1994
- Method and structure to interconnect traces of two conductive layers in a printed circuit board113US 5,906,042 AProlinx Labs Corporation · 1999
- Metal substrated printed circuit91US 4,858,073 AAkzo America Inc. · 1989
- Self regulating temperature heater as an integral part of a printed circuit board90US 5,010,233 AAMP Incorporated · 1991
- Multi-layer, multi-chip pyramid and circuit board structure90US 5,715,144 AInternational Business Machines Corporation · 1998