US 2026/0198152 A1 · METHOD AND DEVICE FOR DEPOSITING COMPONENTS ON A SUBSTRATE

Abstract

A deposition device is provided for depositing components on a substrate. The deposition device comprises a substrate holder, a component carrier, a power supply and a support module for supporting the component carrier. The substrate holder has a substrate support surface for holding the substrate. The component carrier, which is supported by the support module has a component carrier surface facing the substrate support surface for carrying the components to be deposited on the substrate. The component carrier comprises a resistive heater layer for thermally inducing a deformation of the component carrier to move the component carrier surface towards the substrate support surface. The power supply is configured to generate a deflection pulse, being an electric power pulse to the resistive heater layer for said thermally inducing a deformation. Also a corresponding deposition method is provided.

Claims20

Dependent claims

A deposition device for depositing components on a substrate, the device comprising:

a substrate holder having a concave substrate support surface for holding the substrate, the concave substrate support surface having evacuation channels configured to be evacuated, so as to bias the substrate against the concave substrate support surface;
a component carrier having a component carrier surface, which faces the concave substrate support surface, for carrying the components to be deposited on the substrate, wherein the component carrier comprises a resistive heater layer for thermally inducing a deformation of the component carrier to move the component carrier surface towards the concave substrate support surface;
a power supply configured to generate a deflection pulse that is an electric power pulse provided to the resistive heater layer to carry out the thermally inducing a deformation of the component carrier;
and
a support module for supporting the component carrier.

2 more elements

A method of depositing components on a substrate, comprising:

providing a component carrier, having a component carrier surface;
adhering the components on the component carrier surface;
arranging the substrate on a concave substrate support surface of a substrate holder, with the concave substrate support surface facing the component carrier surface, and evacuating evacuation channels in the concave substrate support surface, so as to bias the substrate against the concave substrate support surface;
resistively heating the component carrier to induce a thermal expansion therein to move the component carrier surface towards the concave substrate support surface;
and
cooling or allowing the component carrier to cool to cause the component carrier to move away from the substrate holder.

3 more elements

Dependencies are inferred from the claim text.

Method and device for depositing components on a substrate

Life of this patent

Method and device for depositing components on a substrate

Life of this patent

Abstract

Claims20