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US 2026/0032804 A1Published application
Circuit Board Cooling Configurations
AssigneeMicrosoft Technology Licensing, LLC
InventorRuslan NAGIMOV
Life of this patent
Estimating the term…
Abstract
The discussion relates to thermal management. One example can include a circuit board including inner, intermediate, and outer generally concentric zones and a cryogenically cooled chip located in the inner zone as well as non-cryogenic electronic components positioned in the outer zone. In this example, the intermediate zone can have a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.
Claims20
A system, comprising:
- a circuit board including inner intermediate and outer generally concentric zones;
- a cryogenically cooled chip located in the inner zone;
- non-cryogenic electronic components positioned in the outer zone;
- and,
- the intermediate zone having a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.
2 more elements
A device, comprising:
- a circuit board including an inner zone separated from an outer zone by an intermediate zone;
- a cold chip located in the inner zone that has an operating temperature below standard temperature;
- an electronic component positioned in the outer zone that has an operating temperature above standard temperature;
- and,
- the intermediate zone having a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone to prevent the electronic component of the outer zone from being cooled below the standard temperature.
2 more elements
A device, comprising:
- a circuit board including an inner zone separated from an outer zone by an intermediate zone;
- a cold chip located in the inner zone and cooled by a cooling system;
- and,
- the intermediate zone having a skeletonized configuration configured to slow thermal energy movement from the outer zone to the inner zone.
1 more element
Dependencies are inferred from the claim text.