Method and structure to interconnect traces of two conductive layers in a printed circuit board

A method of forming a structure for supporting a plurality of electronic components, said method comprising:

• forming a compound layer comprising a first material and a dielectric layer, said first material being located in at least a first hole in said dielectric layer;
• and
• programming the first material located in said first hole;
• wherein:
• said compound layer separates a first conductive layer from a second conductive layer;
• and
• said step of forming comprises:
• stencil printing said first material;
• and
• screen printing said dielectric layer.

A method of forming a structure for supporting a plurality of electronic components, said method comprising:

• forming a compound layer comprising a first material and a dielectric layer, said first material being located in at least a first hole in said dielectric layer;
• applying an adhesive layer over said compound layer prior to formation of said second conductive layer, said adhesive layer having a thickness less than a thickness of said compound layer;
• and
• programming the first material located in said first hole;
• wherein:
• said compound layer separates a first conductive layer from a second conductive layer.

A method of forming a structure for supporting a plurality of electronic components, said method comprising:

• forming a compound layer comprising a first material and a dielectric layer, said first material being located in at least a first hole in said dielectric layer;
• and
• programming the first material located in said first hole;
• wherein:
• said compound layer separates a first conductive layer from a second conductive layer;
• said first material has a second breakdown voltage lower than a first breakdown voltage of said dielectric layer;
• said programming voltage is greater than or equal to said second breakdown voltage;
• and
• said programming step forms an electrical conductor connecting said conductive layers.

A method of forming a structure for supporting a plurality of electronic components, said method comprising:

• forming a compound layer comprising a first material and a dielectric layer, said first material being located in at least a first hole in said dielectric layer;
• and
• programming the first material located in said first hole;
• wherein:
• said compound layer separates a first conductive layer from a second conductive layer;
• and
• said forming step further comprises providing a plurality of dams.

A method of forming a structure for supporting a plurality of electronic components, said method comprising:

• forming a compound layer comprising a first material and a dielectric layer, said first material being located in at least a first hole in said dielectric layer;
• and
• programming the first material located in said first hole;
• wherein:
• said compound layer separates a first conductive layer from a second conductive layer;
• said first material is densely populated with conductive particles;
• and
• a programming current is passed through said micro filled via material to reduce the resistance of an electrical conductor originally formed in said first material.

A method of forming a structure for supporting a plurality of electronic components, said method comprising:

• forming a compound layer comprising a first material and a dielectric layer, said first material being located in at least a first hole in said dielectric layer;
• and
• programming the first material located in said first hole;
• wherein:
• said compound layer separates a first conductive layer from a second conductive layer;
• said first material comprises a dielectric material;
• and
• said step of programming comprises breaking down said dielectric material to form at least one carbonized filament.

A method of forming a structure for supporting a plurality of electronic components, said method comprising:

• forming a compound layer comprising a first material and a dielectric layer, said first material being located in at least a first hole in said dielectric layer, wherein said compound layer separates a first conductive layer from a second conductive layer;
• forming said first conductive layer on an insulating core layer having embedded glass fibers;
• and
• programming the first material located in said first hole.

A method comprising:

• forming a dielectric layer devoid of woven glass fibers on at least a first trace of a first conductive layer;
• forming a plurality of holes at a plurality of predetermined locations in said dielectric layer, each of said predetermined locations being a location for formation of an electrical conductor;
• placing a micro filled via material in at least each of said plurality of holes, to form a compound layer;
• laminating a second conductive layer on said compound layer;
• etching said second conductive layer to form at least a second trace;
• wherein said dielectric layer is a photoimagable layer, and wherein said step of forming a plurality of holes comprises imaging and developing said photoimagable layer.